FAQ (Frequently Asked Questions)
Questions
Is data generated with NEXTRA® usable for test and analysis?What rules have to be obeyed for creation and extension of the package library?
NEXTRA® supports a set of converters e.g. for Allegro, Expedition and Visula. Does this allow to use NEXTRA® as a cross-converter, to transfer data e.g. from Visula to Boardstation or from Expedition to Allegro?
To which extent does NEXTRA® support CAE integration?
Does NEXTRA® use existing DRCs?
Which advantages does NEXTRA® give for flexible pcb design?
Which formats can be suggested for importing mechanical CAD data?
How does NEXTRA® implement ECAD integration?
How does NEXTRA® implement MCAD integration?
To what extent does NEXTRA® support micro vias?
To what extent does NEXTRA® support hte MID (Molded Inteconnect Device) technology?
Is it possible to design multi-layer boards with NEXTRA®?
What functions does NEXTRA® offer for routing?
What functions does NEXTRA® offer for circuitry creation?
What are the minimum hardware requirements for NEXTRA®?
Is a NEXTRA® version with restricted functionality available?
What is the difference between IDF and NEXTRA®?
Answers
Question: Is data generated with NEXTRA® usable for test and analysis?Answer: NEXTRA® generates a detailed, three-dimensional model of any electronical circuitry - planar pcbs, flex-boards and MIDs -, which can be used for design, analysis and manufacturing purposes. Cooperations with partners enable a process flow to transfer this data to analytic engineering packages.
Question: What rules have to be obeyed for creation and extension of the package library?
Answer: While reading package data NEXTRA® uses the two-dimensional outline of package geometries. If a height value is given for such a package a block with the given outline and the height is automatically created. Furthermore 3D geometries for packages can be defined which are loaded automatically and used instead of such simple blocks when available. The creation of such 3D geometries for packages is done within the NEXTRA® environment using a 3D symbol editor which supported by a creation wizard creates standard packages by asking for few characteristic parameters like number of pins, pitch, lead and body shape. Additionally this 3D symbol editor can access the existing 2D package library and read that characteristic parameters to simplify the 3D package geometry creation even more. Furthermore NEXTRA® is delivered with a constantly growing 3D package library.
Question: NEXTRA® supports a set of converters e.g. for Allegro, Expedition and Visula. Does this allow to use NEXTRA® as a cross-converter, to transfer data e.g. from Visula to Boardstation or from Expedition to Allegro?
Answer: Yes, this is in general possible. This cross converter functionality is a side effect of the tight integration into leading ECAD systems. See more on that topic in integration ECAD.
Question: To which extent does NEXTRA® support CAE integration?
Answer: NEXTRA® supports most most formats from schematic tools and even allows forward and backward annotation. That means, that netlists can read and logical and electrical changes can be transferred back to schematic tools. Functions for pin and gate swap are available.
Question: Does NEXTRA® use existing DRCs?
Answer: Defined parameters for design rule checks are imported from designs or libraries and used within NEXTRA®. All design rule checks, regular clearances and collision checks between any design elements are calculated on their true 3D shape.
Question: Which advantages does NEXTRA® give for flexible pcb design?
Answer: NEXTRA® allows you to bend an outline with any bend radius, bend angle in any axes as long as the bending process is physically reasonable. The layout of flex boards is done in NEXTRA® in its true geometrical assembly situation. That means you work on an exact 3D model of the circuitry carrier and have continuously control over possible collisions of carrier, components and enclosures. Individual surfaces of the carrier can be displayed in different modes e.g. wire frame or shaded. A two-dimensional unwinded representation of the bent flex board is permanently available. It an be used for 2D processes like gerber output or 2D design transfer.
Question: Which formats can be suggested for importing mechanical CAD data?
Answer: Without restrictions the neutral format STEP (AP203 and AP214) can be suggested and furthermore native formats for Catia V4/V5, ProEngineer and Parasolid (Unigraphics, SolidWorks and SolidEdge).
Question: How does NEXTRA® implement ECAD integration?
Answer: The integration into the leading EDA-systems from vendors Mentor Graphics, Cadence and Zuken is done through interfaces to netlist (schematic), libraries, autorouters and 2D layout. That leads to the the possibility of integrating NEXTRA® into running design processes and extend these design processes by new functions for 3D layout. You can swith from your PCB system to NEXTRA® and even back at any time in your design process by transferring data from and to NEXTRA®.
Question: How does NEXTRA® implement MCAD integration?
Answer: The integration into numerous mechanical CAD-systems like Catia V4 and V5, ProEngineer, Unigraphics, SolidWorks or other Parasolid and Acis based systems is done via neutral or native interfaces.
Question: To what extent does NEXTRA® support micro vias?
Answer: NEXTRA sopports through vias, stacked and buried vias in any shape.
Question: To what extent does NEXTRA® support hte MID (Molded Inteconnect Device) technology?
Answer: The NEXTRA® technology is based on the high sophisticated electro-mechanical design of three-dimensional circuitry carriers, which may even contain free form surfaces. The component placement e.g. is done taking into account the real and exact shape of the carriers surfaces. For the MID technology we offer a specific module. The technology library contains specific design rules for MID design which can be extended by the customer. For MID manufacturing NEXTRA® offers a direct interface to LDS machines of LPKF which produces manufacturing data for these machines.
Question: Is it possible to design multi-layer boards with NEXTRA®?
Answer: NEXTRA® supports the design of single and multi layer boards. The number of layers is not restricted. The board outline can have any shape. For gerber output individual layers are selectable.
Question: What functions does NEXTRA® offer for routing?
Answer: NEXTRA® supports manual and automatic routing. NEXTRA® offers interfaces to the autorouters Specctra, Electra, Preditor and AutoActive. Interaktive manual routing is possible on any carrier like planar pcbs (single and multi layer), flex boards and MIDs.
Question: What functions does NEXTRA® offer for circuitry creation?
Answer: NEXTRA® creates the circuitry using the package footprints, routed tracks, vias, copper areas and power planes. The cicuitry can be exported via conventional outputs like gerber or in real geometry to MCAD systems.
Question: What are the minimum hardware requirements for NEXTRA®?
Answer: NEXTRA® can be used resonably on Intel compatible computers with the following features: INTEL Pentium III/AMD XP > 1GHZ, 512 MB RAM, 600 MB disk space, CD-ROM drive for installation. The bottleneck using a 3D CAD sstem like NEXTRA® is the graphics adapter. We suggest to use a high end professional CAD graphics adapter with hardware OpenGL acceleration. NEXTRA® installs on Windows NT/2000/XP. On request we may deliver on UNIX like operating systems.
Question: Is a NEXTRA® version with restricted functionality available?
Answer: We offer a simplified view only module of NEXTRA®. This module allows to combine data from MCAD and ECAD systems for analysis purposes only, like collision checks or EMC and thermal analysis.
Question: What is the difference between IDF and NEXTRA®?
Answer: IDF is a file format to exchange data between ECAD and MCAD systems. NEXTRA® however, is an application which integrates the functionality of both an ECAD and an MCAD system in one system. IDF (IDF 2.0 and IDF 3.0) has been designed to exchange the board outline, components, drill holes and various design areas between the communicating ECAD and MCAD systems. Information of the pcb design, which is electrically relevant like tracks, pads, vias, nets and the board stack-up are not taken into account within IDF. But even if in a data exchange specification this information would have been considered, as it has been done in STEP AP210 or IDF 4.0, this information could not fully be processed neither by a 3D MCAD system nor by a 2D ECAD system. This is because they by design can only process either the three-dimensional geometrical or the two-dimensional and electrical part of the information. Only NEXTRA® is able to create and edit the full electrical and three-dimensional model of a PCB within a 3D environment.