NEXTRA® module for flex technology

The NEXTRA® flex module makes available a number of specific parameters which are adjusted at the specific technology of flexible circuitry carriers. It allows the design of flex boards in respect to the real assembly situation. That means you can design flex boards bended within the mechanical context, e. g. within a package. A two-dimensional unwinding of the 3D flex board is constantly available which can be used for 2D processes.

The NEXTRA® flex module is an upgrade module to the 3D-basis-technology module as PCB.

Additionally we offer a number of integrations into the leading EDA systems so that you can integrate NEXTRA® into your existing design process easily. We offer a 3D symbol editor that easily creates 3D package geometries using your existing 2D package libraries. Within the framework of a stand-alone-installation we offer NEXTRA®'s own library where you can store and manage comprehensive information about technologies, parts and packages.

Cooperations with partners enable you to transfer the 3D-data created by NEXTRA® to various engineering packages for analytic studies, e. g. EMC, thermal or RF simulations.