NEXTRA® module for MID technology

NEXTRA® is a tool for the design of MIDs (Moulded Interconnect Devices) which integrates eletronical and mechanical design in one 3D system. The design process is supported by special features oriented towards the MID technology: the so-called "segment wise unwinding" allows to use the circuitry structure of the three-dimensional circuitry carrier in two dimensions, e. g. for autorouting or output of manufacturing data.

In cooperation with LPKF Laser & Electronics AG MECADTRON supports a direct interface to the LDS technology in the NEXTRA® MID module. The LDS technology (laser direct structuring) was developed by LPKF especially for MIDs. With NEXTRA® you can directly transfer the circuitry structure of any MID to the laser machine to structure the surfaces of the molded parts. Time-consuming manual creation of the circuitry data which had to be formerly designed in a mechanical CAD system is done with NEXTRA® efficiently in a specific routing environment.

The NEXTRA® MID module can be used as a 3D basis module and upgrated by the module for PCB technology.

Additionally we offer a number of integrations into the leading EDA systems so that you can integrate NEXTRA® into your existing design process easily. We offer a 3D symbol editor that easily creates 3D package geometries using your existing 2D package libraries. Within the framework of a stand-alone-installation we offer NEXTRA®'s own library where you can store and manage comprehensive information about technologies, parts and packages.

Cooperations with partners enable you to transfer the 3D-data created by NEXTRA® to various engineering packages for analytic studies, e. g. EMC, thermal or RF simulations.